THERMOCOMPRESSION BONDING OF GOLD WIRE FOR MICROELECTRONIC CIRCUITS,

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Abstract:

The report details a technique for interconnecting master die integrated circuits using thermocompression bonding. Primary coverage is given to specific results achieved and the techniques used. Author

Author(s):
Higbie, Thomas E.
Author Organization(s):
NAVAL AVIONICS FACILITY INDIANAPOLIS IND
Pagination:
0035

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
NAFI-TR-1108
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
(*INTEGRATED CIRCUITS, *SPOT WELDING), (*DIFFUSION BONDING, *GOLD), SEMICONDUCTOR DEVICES, SUBSTRATES, TEMPERATURE, TIME, PRESSURE, STATISTICAL ANALYSIS, PHYSICAL PROPERTIES, MANUFACTURING
Field(s)/Group(s):
Electrical and Electronic Equipment, Fabrication Metallurgy
Keyword(s):
INTERMETALLIC COMPOUNDS, PURPLE PLAGUE(METALLURGY), *THERMOCOMPRESSION BONDING
Report Date:
1967 Oct 26