MICROELECTRONICS ENGINEERING.  DESIGN, FABRICATION, MATERIALS AND PACKAGING.

MICROELECTRONICS ENGINEERING. DESIGN, FABRICATION, MATERIALS AND PACKAGING.

Active / Technical Report | Accession Number: AD0652388 |

Abstract:

Content Design considerations and methods using advanced electronic fabrication techniques A survey of microelectronic technology Vacuum technology Guidelines for design and layout of thin-film circuits Functional design using microelectronic techniques Common materials encountered in microelectronics Heat transfer design considerations for microelectronic modules Microelectronic electrical connection techniques Microelectronic packaging techniques. Author

Author(s):

No Author(s) Identified

Author Organization(s):

NAVAL AVIONICS FACILITY INDIANAPOLIS IND

Pagination:

0097

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:

Approved For Public Release

RECORD

Collection: TR

Identifying Numbers

Report Number(s):

NAFI-TP-202

Subject Terms

Communities of Interest:

Advanced Electronics

Descriptor(s):

*MICROELECTRONICS, MANUFACTURING, PACKAGING, MATERIALS, ELECTRONIC EQUIPMENT, FILMS, INTEGRATED CIRCUITS, TRANSISTORS, CIRCUITS, MODULES(ELECTRONICS), HEAT, ELECTRIC CONNECTORS, THEORY, TEST METHODS

Field(s)/Group(s):

Electrical and Electronic Equipment

Report Date:

1964 Jan 01