A DIFFUSION BONDING PROGRAM.

reportActive / Technical Report | Accession Number: AD0651545 | Need Help?

Abstract:

An evaluation was made of diffusion bonding processes and techniques. The use of evaporated aluminium patterns on polyimide H film provided the interconnecting metallization. This report summarizes the work, including the development of optimum bonding parameters, the fabrication of a significant number of bonds, and the testing of these bonds. Author

Author(s):
Clark, P. R. ; Baker, Henry
Author Organization(s):
HONEYWELL INC ST PETERSBURG FLA
Descriptive Note:
Final rept., 1 Feb 66-31 Dec 66,
Pagination:
0051

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RADC-TR-67-62
Contract/Grant Number(s):
AF 30(602)-4059
Task Number(s):
551904
Project Number(s):
AF-5519
Monitor Series:
TR-67-62
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
(*DIFFUSION BONDING, CIRCUIT INTERCONNECTIONS), (*INTEGRATED CIRCUITS, DIFFUSION BONDING), ALUMINUM, VAPOR PLATING, SUBSTRATES, POLYAMIDE PLASTICS, FILMS, PERFORMANCE(ENGINEERING), MANUFACTURING, BONDED JOINTS
Field(s)/Group(s):
Electrical and Electronic Equipment, Fabrication Metallurgy, Plastics
Report Date:
1967 Apr 01