ENHANCED MICRO-MODULE INTERCONNECTIONS. AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS.

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Abstract:

A pilot production capability was established to assembly 100 Enhanced Micro Modules per eight hour shift. The Enhanced Micro Module is an all electron beam welded, hermetically sealed interconnection packaging system which is compatible with all approaches to microminiaturization. The production capability was demonstrated by the assembly of Engineering Model Design Enhanced Micro Modules which are nonfunctional units designed to check a significant number of welds as well as the integrity of the structure before and after environmental exposure. Ten Stage Binary Divider Enhanced Micro Modules were assembled to demonstrate compatibility with monolithic integrated circuits. All the tools, fixtures, machines and processes were developed and are operational. Author

Author(s):
Garibotti, D. J.
Author Organization(s):
HAMILTON STANDARD BROAD BROOK CONN ELECTRONICS DEPT
Descriptive Note:
Final rept. for 12 Jun 63-15 Mar 65,
Supplementary Note:
See also AD-611 284.
Annotation:
Enhanced micro-module interconnections. An hermetic packaging system for the integration of micro circuits.
Pagination:
0166

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
HSER-3078
Contract/Grant Number(s):
DA36 039AMC03620E
 Subject Terms
Communities of Interest:
Materials and Manufacturing Processes
Descriptor(s):
MICROMINIATURIZATION, INTEGRATED CIRCUITS, MODULES(ELECTRONICS), ELECTRON BEAMS, WELDING, HERMETIC SEALS, MANUFACTURING
Report Date:
1965 Mar 15