MICROELECTRONIC PACKAGING CONCEPTS.

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Abstract:

All aspects of microcircuit packaging are studied and each of the three basic approaches to the packaging of microcircuits are investigated and evaluated. These three approaches are 1 TO-type containers, 2 glass and metal flat packages, 3 encapsulated type packages. Evaluation is done in the areas of thermal properties, frequency limitations, form factor and ease of interconnection, reliability and cost. Construction details for each type of package are discussed and various commercially available microcircuit packages are cataloged. Thermal ratings of circuit packages are formulated with regard to power dissipation per circuit and allowable power densities in the system. Testing procedures are outlined to allow the thermal characterization of any microcircuit package. In this area, several curves are given showing the variation in case-to-ambient thermal resistance as a function of air flow and system power density. Conclusions are then drawn concerning the relative merits of each packaging approach. Author

Author(s):
Hamburger, T. ; Gourse, S.
Author Organization(s):
WESTINGHOUSE ELECTRIC CORP BALTIMORE MD SURFACE DIV
Descriptive Note:
Final technical rept. for 1 Jan-31 Dec 64,
Annotation:
Microelectronic packaging concepts for microcircuits.
Pagination:
0325

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
RADC-TR-65-61
Contract/Grant Number(s):
AF30 602 3285
Task Number(s):
551904
Project Number(s):
5519
Monitor Series:
TR-65-61
 Subject Terms
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*MODULES(ELECTRONICS), MICROELECTRONICS, SUBMINIATURE ELECTRONIC EQUIPMENT, PACKAGING, CONTAINERS, GLASS, ENCAPSULATION, THERMAL PROPERTIES, RELIABILITY(ELECTRONICS), PERFORMANCE(ENGINEERING)
Report Date:
1965 Jul 01