ETCHING CIRCUITRY ON METALLIZED ANODIZED ALUMINIUM,

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Abstract:

This report describes a method of preparing etched circuitry on metallized anodized aluminum and its use in fabricating parts for a thermoelectric temperature-control device. The method comprised anodization of type 52S aluminum, dual metal cladding with electroless nickel and electroplated copper, and photoetching of the desired circuitry on the anodized aluminum. Satisfactory adhesion of the metal conductors, high insulation resistance, and good thermal conductance of the thin anodized layer resulted in an excellent thermoelectric temperature device, and suggested other as yet unattempted applications. Author

Author(s):
Hebb, Emma Lee
Author Organization(s):
HARRY DIAMOND LABS WASHINGTON D C
Annotation:
Etching circuitry on metallized anodized aluminium.
Pagination:
0012

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
HDL-TM62 77
Project Number(s):
96392
Monitor Series:
TM62 77
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
PHOTOENGRAVING, CIRCUITS, ALUMINUM, COATINGS, OXIDATION, ALUMINUM COMPOUNDS, OXIDES, FILMS, CLADDING, NICKEL, COPPER, ELECTROPLATING, ELECTRICAL RESISTANCE, THERMAL CONDUCTIVITY, THERMOELECTRICITY, TEMPERATURE CONTROL, SEMICONDUCTORS
Keyword(s):
ANODIZATION, ANODIC COATINGS, ALUMINUM, ANODIC COATINGS, ETCHED CIRCUITS, THIN FILMS
Report Date:
1962 Oct 15