PRODUCTION ENGINEERING MEASURE TO INCREASE THE RELIABILITY OF THE TRANSISTOR TYPE 22N2034.

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Abstract:

The report describes the processing developments in wafer cleaning, mesa delineation, scribing of water, pellet to nickel-plated header soldering, nickel-plated clip to pellet soldering, final etch of soldered unit, final test and encapsulation of etched units, and weld and hermetic seal tests for the transistor type 2N2034. Author

Author(s):
Cocking, J. ; Courier, J. ; Des Roches, F. ; Hughes, D. ; Martin, E.
Author Organization(s):
SILICON TRANSISTOR CORP GARDEN CITY N Y
Descriptive Note:
Quarterly progress rept. no. 4, 1 Apr-30 Jun 64,
Annotation:
Production engineering measure to increase the reliability of the transistor type 2N2034.
Pagination:
0029

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
DA36 039AMC01482E
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*TRANSISTORS, RELIABILITY(ELECTRONICS), PROCESSING, DISKS, SILICON, CLEANING, ABRASIVE BLASTING, SOLDERING, CHEMICAL MILLING, ENCAPSULATION, WELDING, HERMETIC SEALS, CONTROLLED ATMOSPHERES, PERFORMANCE(ENGINEERING), NICKEL, PELLETS
Report Date:
1964 Jun 30