THERMAL CONDUCTIVITY OF COPPER-NICKEL ALLOYS AT 4.2 K

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Abstract:

The lattice thermal conductivity of the complete Cu-Ni alloy series at 4.2 K has been derived from the measurement of the total thermal conductivity and the electrical residual resistivity of annealed specimens. It was found that copperrich alloys decrease with increasing content of nickel. For the most nickel-rich alloy Cu 02 Ni 98 indications of additional phonon scattering processes, perhaps by spin-disorder, are found. The influence of plastic deformation has been measured and is briefly discussed.

Author(s):
Erdmann, Joachim C. ; Jahoda, James A.
Author Organization(s):
BOEING SCIENTIFIC RESEARCH LABS SEATTLE WA
Pagination:
0026

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Monitor Series:
DOD
 Subject Terms
Joint Capability Areas:
JCA_1.2.7_Experimentation; JCA_5.3_Planning; JCA_5_Command and Control
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*COPPER ALLOYS, *THERMAL CONDUCTIVITY, *CRYOGENICS, *NICKEL ALLOYS, SCATTERING, COMPUTERS, PHASE STUDIES, WEIGHT, GRAIN STRUCTURES(METALLURGY), CHEMICAL ANALYSIS, PHONONS, PLASTIC PROPERTIES, HEAT TREATMENT, ELECTRICAL CONDUCTIVITY, CRYSTAL LATTICES, DEFORMATION
Field(s)/Group(s):
Metallurgy and Metallography, Thermodynamics
Report Date:
1964 Apr 01