PRODUCTION ENGINEERING MEASURE FOR MULTILAYER PRINTED WIRING BOARD.

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Abstract:

Evaluation of processes for manufacture of layered printed wiring using the clearance hole method of manufacture resulted in the selection of the wave soldering method for fillet formation on individual layers, the use of multispindle drilling machines for drilling clearance holes in individual layers and component holes in laminated parts, and in some other minor changes which will improve the efficiency of the production line and the quality of the product. The finalizing of processes made it possible to establish production rates, manpower and lead time requirements, and to schedule all operations except spot facing, which is still undergoing investigation to determine the optimum method. Testing of the second set of 50 engineering samples was completed. They met the requirements of SCL-7503B specification with minor deviations. Corrective measures to eliminate such deviations from preproduction samples are recommended. Work on the Quality Assurance Manual and Inspection Plan, as well as on preparation of specifications for Prepreg epoxy adhesive material, is continuing. Author

Author(s):
Messner, G. ; Mccaw, R. ; Paluszek, M.
Author Organization(s):
PHOTOCIRCUITS CORP GLEN COVE N Y
Descriptive Note:
Quarterly rept., nos. 4 and 5 (Rept. no. 4) 1 Apr - 30 Sep 63
Annotation:
Production methods for multilayer printed wiring boards.
Pagination:
0107

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
DA36 039SC86745
 Subject Terms
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*PRINTED CIRCUITS, *SUBMINIATURE ELECTRONIC EQUIPMENT, PRODUCTION, MANUFACTURING, LAMINATES, SOLDERING, DRILLING MACHINES, QUALITY CONTROL, STANDARDS, ADHESIVES, EPOXY RESINS, GLASS TEXTILES
Report Date:
1963 Sep 30