INTEGRATED CIRCUIT THERMAL STUDY.

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Abstract:

Results of a study of the thermal considerations in monolithic silicon integral circuit devices are presented. Thermal instrumentation techniques using conventional thermocouples to measure chip temperatures and a method of implementing the use of base to emitter voltage versus temperature characteristic were developed. The usefulness of available infrared equipment was also evaluated. Digital computer implemented thermal analyses were investigated. Data are presented showing the magnitude of thermal gradients and thermal resistances for typical devices in a TO-5 case and in an all ceramic flat package. Author

Author(s):
Baum, J. R.
Author Organization(s):
MOTOROLA INC SCOTTSDALE AZ MILITARY ELECTRONICS DIV
Descriptive Note:
Final rept.,
Annotation:
Integrated circuit thermal study.
Pagination:
0160

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
WF-2990-1, NADC-AE-6516
Contract/Grant Number(s):
N62269-2393
Task Number(s):
RAV03J0022021R0080301
Monitor Series:
6516
 Subject Terms
Communities of Interest:
Advanced Electronics
Descriptor(s):
(*INTEGRATED CIRCUITS, THERMAL PROPERTIES), SILICON, THERMOCOUPLES, TEMPERATURE, MEASUREMENT, VOLTAGE, INFRARED EQUIPMENT, THERMAL ANALYSIS, DIGITAL COMPUTERS, EMISSIVITY, RADIOMETERS, MICROSCOPES, CERAMIC MATERIALS, PACKAGED CIRCUITS, THERMAL CONDUCTIVITY, COMPUTER PROGRAMMING, TEST EQUIPMENT, WIRING DIAGRAMS, TRANSISTORS, BOUNDARY LAYER
Field(s)/Group(s):
Electrical and Electronic Equipment
Report Date:
1965 Nov 15