MODULAR INTERCONNECTIONS FOR HERMETIC MICRO-ASSEMBLIES.

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Abstract:

The three major objectives pursued during the course of this program were Task A. Modular Interconnection and Hermetic Sealing of Micro-Assembly Stacks. Ten wafer microassembly stacks fabricated by electron beam processes have been connected to the pins of hermetic headers by transform interconnecting media and hermetically sealed within electron beam welded cans. Task B. - Hermetic Sealing of Soldered Micro-Module Element Stacks. Soldered Micro-Module stacks were integrated with hermetic headers and the resultant structures hermetically sealed within an electron beam welded can. Task C. - Evaluation of Electron Beam Microwelds to Discrete Terminations. A high resolution metalizing process was developed for the formation of closely spaced terminations on all four edges of .310 x .310 inch substrates. Author

Author(s):
Garibotti, D. J. ; Taylor, J. E.
Author Organization(s):
HAMILTON STANDARD BROAD BROOK CT ELECTRONICS DEPT
Descriptive Note:
Quarterly rept. no. 4 (Final), 20 Feb 6227 Apr 64,
Annotation:
Modular interconnections for hermetic micro-assemblies.
Pagination:
0001

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Report Number(s):
HSER2880
Contract/Grant Number(s):
DA36 039sc89176
Task Number(s):
3A991500203
Project Number(s):
3A99 15 002
 Subject Terms
Communities of Interest:
Materials and Manufacturing Processes
Descriptor(s):
*MODULES(ELECTRONICS), *SUBMINIATURE ELECTRONIC EQUIPMENT, CIRCUIT INTERCONNECTIONS, CIRCUIT INTERCONNECTIONS, MODULES(ELECTRONICS), PROCESSING, ELECTRON BEAMS, WELDING, PACKAGING, SOLDERING, COPPER, METAL FILMS, ELECTROPLATING, ELECTRICAL RESISTANCE, THICKNESS, OXIDES, GOLD, CHROMIUM
Keyword(s):
THIN FILMS
Report Date:
1964 Apr 01