MICROMINIATURE INTEGRATED CIRCUIT PACKAGE

reportActive / Technical Report | Accession Number: AD0426956 | Open PDF

Abstract:

Design and fabrication of two metal to glass seal microminiature integrated circuit packages were completed. One which utilized the .310 inch square ceramic base as an integral portion of the package and the other a .225 in. square package per the stated requirements of the contract, the .310 in. square package required more development as leak rates of only less than 1 x 10 to the minus 6 power ccsec at one atmosphere were achieved. However, on the contract package lead rates less than 1 x 10 to the minus 8 power ccsec at one atmosphere were attained. This was accomplished through revisions of graphite molds, glass preform designs, kovar oxide layer control and sealing techniques. To prove package feasibility, twenty-four Westing house Functional Electronic Blocks were encapsulated in the .225 in. square microminiature planar package. No problems in assembly were encountered.

Author(s):
Barbaro, E. P.
Author Organization(s):
WESTINGHOUSE ELECTRIC CORP ELKRIDGE MD
Descriptive Note:
Final rept., 1 July 1962-1 Aug 1963
Annotation:
Fabrication and test of microminiature circuit and module for integrated package.
Pagination:
0066

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
DA-36-039-SC-90850
Project Number(s):
3-A-99-21-002-01
Monitor Series:
USASRDL
 Subject Terms
Joint Capability Areas:
JCA_4.6_Engineering; JCA_4.6.1_General Engineering; JCA_1_Force Support; JCA_1.2_Force Preparation; JCA_3.2_Engagement; JCA_3_Force Application; JCA_3.2.1_Kinetic Means; JCA_1.2.3_Educating
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*INTEGRATED CIRCUITS, PRODUCTION, LEAKAGE(FLUID), GLASS, CERAMIC MATERIALS, FEASIBILITY STUDIES, ENVIRONMENTAL TESTS, SEALS(STOPPERS)
Field(s)/Group(s):
Electrical and Electronic Equipment
Report Date:
1963 Aug 01