A MECHANICAL POLISHING TECHNIQUE FOR SEMICONDUCTOR MATERIALS,

Beams, R. B.; Klute, C. H.

A MECHANICAL POLISHING TECHNIQUE FOR SEMICONDUCTOR MATERIALS,

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Abstract:

A method for obtaining a very finely polished surface on semiconductor wafers has been devised. The mechanical arrangements include a polishing machine in which special care is used to continuously remove the abraded semiconductor particles from the polishing medium. The method uses only two major operations and yields a polished surface that is measurably smoother and flatter than the commercially polished specimens examined for comparison. Author

Author(s):

Beams, R. B. ; Klute, C. H.

Author Organization(s):

HARRY DIAMOND LABS WASHINGTON D C

Pagination:

0024

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:

Approved For Public Release

RECORD

Collection: TR

Identifying Numbers

Report Number(s):

HDL-TR1180

Project Number(s):

HDL96300

Monitor Series:

TR1180

Subject Terms

Communities of Interest:

Advanced Electronics

Descriptor(s):

PRECISION FINISHING, POLISHES, GERMANIUM, SILICON, OXIDES, JIGS, CUTTING FLUIDS

Report Date:

1963 Oct 30