MICROELECTRONIC CIRCUITRY IN MICRO-MODULES.

This report describes the steps undertaken in the microminiaturization of Signal Corps modules used in a subassembly previously manufactured from standard components. This subassembly is a shift register consisting of 28 flip-flops, one 4-gate networks, and three driver circuits. For each type of circuit, a typical layout every film is shown at 10X scale. For the first con ductor film on the flip-flop circuits, the com plete 16 position mask is shown in full scale. A description of the material used, the thick ness, and the functions of each film is given, together with the method of monitoring during deposition. Author