SOLDERABILITY OF PRINTED CIRCUITS.

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Abstract:

The objective of this project is to develop test methods for the solderability testing of printed circuit boards to be used in dip and flow solder operations and to compile sufficient test data to enable the test method to be used under a variety of conditions. The redesign of the solderability test fixture and the development of a standard test pattern are discussed. Also covered are test results from natural and arti ficial aging of boards. A test technique has been developed in detail for dip solderability testing. Author

Author(s):
Fabish, Joel
Author Organization(s):
GENERAL ELECTRIC CO SYRACUSE NY
Descriptive Note:
Quarterly progress rept. no. 2, 1 Jan-31 Mar 63,
Annotation:
Solderability of printed circuits; quarterly progress rept. no. 2; test fixtures and test techniques.
Pagination:
0037

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
DA36 039AMC00008
Task Number(s):
703
 Subject Terms
Joint Capability Areas:
JCA_5.3_Planning; JCA_5_Command and Control
Communities of Interest:
No COI(s) Identified
Descriptor(s):
*PRINTED CIRCUITS, *SOLDERING, SOLDERING FLUXES, TEST EQUIPMENT, SOLDERING, TEST METHODS, TEMPERATURE, AGING(MATERIALS), CLEANING, STEAM
Report Date:
1963 Mar 31