MICROELECTRONIC CIRCUITRY IN MICRO-MODULES

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Abstract:

The microminiaturization of a Signal Corps air encoder subassembly is described. The subassembly is a shift register consisting of 28 flip-flops, 1 gate, and 3 driver circuits. These circuits are to be vacuum deposited on .310 inch square glass substrates and then stacked into micro-modules .625 inches in height. The techniques involved in monitoring the vacuum deposition of all films are discussed. Also discussed is a multiprobe jig which makes contact to 22 terminals of a deposited flip-flop and a mask changer which allows the changing of 4 masks without breading vacuum. Maximum accumulated mask registration tolerance is - .003 inches.

Author(s):
Weber, H. ; Weld, S. ; Gille, L.
Author Organization(s):
SERVOMECHANISMS INC GOLETA CA
Descriptive Note:
Quarterly progress rept. no. 2, 1 Sep-30 Nov 1961
Pagination:
0049

Security Markings

DOCUMENT & CONTEXTUAL SUMMARY

Distribution:
Approved For Public Release
Distribution Statement:
Approved For Public Release; Distribution Is Unlimited.

RECORD

Collection: TR
Identifying Numbers
Contract/Grant Number(s):
DA-36-039-SC-87316
Task Number(s):
3A991500203
Project Number(s):
3A99-15-002
Monitor Series:
USASRDL
 Subject Terms
Joint Capability Areas:
JCA_5_Command and Control; JCA_6.1.3_Switching and Routing; JCA_6_Net Centric; JCA_1.2_Force Preparation; JCA_1_Force Support; JCA_3.2_Engagement; JCA_3_Force Application; JCA_6.1.1_Wired Transmission; JCA_3.2.1_Kinetic Means; JCA_6.1_Information Transport; JCA_1.2.3_Educating; JCA_5.2_Understand; JCA_6.4.1_Secure Information Exchange
Modernization Areas:
Microelectronics
Communities of Interest:
Advanced Electronics
Descriptor(s):
*SUBMINIATURE ELECTRONIC EQUIPMENT, *MODULES(ELECTRONICS), *CIRCUITS, DIODES, DIGITAL SYSTEMS, MANUFACTURING, MATERIALS, PROCESSING, SEMICONDUCTORS, SOLID STATE PHYSICS, TRANSISTORS, RESISTORS, SANDWICH PANELS, TRIGGER CIRCUITS, PACKAGED CIRCUITS
Field(s)/Group(s):
Electrical and Electronic Equipment
Keyword(s):
*THIN FILMS(STORAGE DEVICES), MICROMINIATURIZATION(ELECTRONICS)
Report Date:
1961 Nov 30