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Accession Number:

AD1151131

Title:

Indium Inks and Pastes for High-Resolution, High-Density Printed Electronics

Author(s):

• Fink, Richard

Author Organization(s):

• CENTRAL COMMAND MACDILL AFB FL

Report Date:

2021-09-15

Abstract:

The technology presented is nanoparticle dispersions (inks and pastes) of indium sub-micron particles for printing indium circuits and solder joints for next-generation electronics packaging and quantum computing.

Document Type:

Conference:

Journal:

Pages:

1

File Size:

0.59MB

Contracts:

Grants:

Descriptors:

• chemistry
• materials
• indium
• particles
• quantum computing
• copper nickel alloys
• high density
• high resolution
• high temperature
• inks
• nanoparticles
• nickel alloys
• particle size
• unified combatant commands
• alloys
• hypersonic weapons
• indium alloys

Identifiers:

• printed electronics

SubjectCategory:

• Electrotechnology and Fluidics
• Test Equipment, Research Facilities and Reprography
• Chemistry

Communities of Interest:

• Weapons Technologies

Distribution Statement:

Approved For Public Release

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