PENNSYLVANIA STATE UNIV UNIVERSITY PARK DEPT OF ENGINEERING SCIENCE AND MECHA NICS
In microwave joining of composite materials as well as in high frequency dielectric heating for processing of polymeric materials, proper loss factors in the joining adhesives and in the sensitizers are essential. A composite material can be tailored through its chiral microstructure to attain a desired absorption mechanism. For surface heating as well as in microwave joining, a fairly high loss factor is produced in chiral composite materials. For volumetric heating, a preferred loss factor can be obtained using chiral composites to optimize the dielectric processing.
This article is from 'Ceramic Transactions. Volume 21. Proceedings of the Symposium on Microwave Theory and Application in Materials Processing Annual Meeting of the American Ceramic Society (23rd) Held in Cincinnati, Ohio on April 29 - May 3, 1991,' AD-A253 631, p523-529.