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Accession Number:
ADP002438
Title:
Recent Results on Fracture Toughness of Bonded Wood,
Corporate Author:
WISCONSIN UNIV-MADISON DEPT OF CHEMICAL ENGINEERING
Report Date:
1980-09-25
Abstract:
This paper summarizes the influence of the following bonding variables on fracture toughness Bondline thickness Wood grain angle with respect to the plane of the bondline, Wood surface roughness Wood moisture content Aging of wood surface Adhesive cure time Initial adhesive viscosity and Effect of adhesive fillers. Most of the data is from HTDCBHeight Tapered Double Cantilever Beam Specimens studies, but some recent WTDCBWidth Tapered Double Cantilever Beam Specimens results which are more applicable specimens for laminate studies are also reported.
Supplementary Note:
This article is from 'Proceedings of 1980 Symposium 'Wood Adhesives-Research, Application, and Needs' Held at Madison, Wisconsin on 23-25 September 1980', AD-A136 708, p189-194.
Pages:
0006
File Size:
0.00MB
