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Accession Number:
ADA010782
Title:
Hardened Hybrid Semiconductor Packages. Task II.
Corporate Author:
WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD SYSTEMS DEVELOPMENT DIV
Report Date:
1975-05-01
Abstract:
The work was performed to develop a radiation hardened packaging technique for packaging a whole round semiconductor wafer. The metal which connected the wafer bonding pads to the package output pins was aluminum which was vapor deposited through a mask on the inside surface of the package. One end of each conductor line was lifted off the package surface to form a beam lead. These beam leads were then ultrasonically bonded to the wafer bonding pads.
Descriptive Note:
Final rept. 1 Jan-31 Jan 75,
Pages:
0027
Contract Number:
DAAG39-73-C-0216
File Size:
0.00MB
