WESTINGHOUSE DEFENSE AND ELECTRONIC SYSTEMS CENTER BALTIMORE MD SYSTEMS DEVELOPMENT DIV
The work was performed to develop a radiation hardened packaging technique for packaging a whole round semiconductor wafer. The metal which connected the wafer bonding pads to the package output pins was aluminum which was vapor deposited through a mask on the inside surface of the package. One end of each conductor line was lifted off the package surface to form a beam lead. These beam leads were then ultrasonically bonded to the wafer bonding pads.