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Accession Number:
AD1043593
Title:
Thermal Simulation of a Diode Module Cooled with Forced Convection
Corporate Author:
US Army Research Laboratory Adelphi United States
Report Date:
2011-07-01
Abstract:
We have performed a thermal simulation of an electronic module cooled by forced convection and compared the simulation to the results of a laboratory test of the module. We modeled the modules geometry and materials, and used the operating conditions of the laboratory experiment as inputs for the simulation. We found close agreement between the steady-state temperatures calculated in our model and the temperatures observed in the laboratory, validating our simulation methods.
Descriptive Note:
Technical Report
Pages:
0014
Distribution Statement:
Approved For Public Release;
File Size:
0.49MB
