Defence Research and Development Canada Quebec Canada
In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology i.e. wafer approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant e.g. about 3 mm in diameter, electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60 in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the micro-assembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256x1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the micro-assembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072x3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512x3 pixel FPAs with a less than 50 micron pixel co-registration is reported.