Accession Number:

AD0773833

Title:

Review of High-Reliability Procurement Practices in the Semiconductor Industry.

Personal Author(s):

Corporate Author:

MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Report Date:

1974-01-11

Abstract:

28-73-C-0002649LESDTR-74-11Semiconductor devices, Electrical industry, Industrial procurement, Quality assurance, Quality control, Test methodsProcess controlHigh-reliability procurement practices in the semiconductor industry have been reviewed in the light of Lincoln Laboratory experience over the past two years. The merits and drawbacks of different types of product assurance methods and specification systems are described. A different kind of procurement method is proposed, in which devices are obtained from the vendors in wafer form on the basis of stringent wafer acceptance tests and subsequently processed on a controlled line under strict quality control conditions including in-process quality control tests, positive lot control and exhaustive screens. Author

Descriptive Note:

Technical note,

Pages:

0035

Identifiers:

Communities Of Interest:

Modernization Areas:

Contract Number:

F19628-73-C-0002

File Size:

0.00MB

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