R&D OF THE TECHNOLOGIES REQUIRED TO DESIGN AND FABRICATE ULTRAHIGH-SPEED COMPUTER SYSTEMS
MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB
A research and development program directed toward the development of high speed computer subsystem fabrication technologies is described and the results of device yield and speed-power dissipation improvements are reported. Small geometry, shallow diffused, npn silicon transistors are utilized in simple ECL circuit forms to achieve high performance at low power dissipation in complex array structures. Various component interconnection technologies are being developed and characterized for high density, high speed subsystems. Multilevel single chip and multichip assemblies are being investigated. Reliability studies of functioning arrays have been initiated.
Interim rept. no. 12, 1 Apr-31 Dec 1967
Prepared in cooperation with Philco-Ford Corp., Blue Bell, Pa. Microelectronics Div., rept. no. X-527. See also interim rept. no. 11, AD0655804.