DEVELOPMENT OF A TACTICAL FIELD COMPUTER (MICROPAC) (TASKS 25B AND 27B).
RAYTHEON CO WALTHAM MASS
A breadboard model of the Micropac Computer was fabricated and evaluated to prove the basic logical design using conventional components of the same specification as their microelement counterparts and packaged in modules. The breadboard computer was subjected to a thorough operational check-out by means of test routines. Mechanical design considerations were paramount in the development of the Micropac computer since miniaturization emphasizes minimum size, weight, and volume modular and plug-in card construction interconnection methods thermal problems accessibility interchangeability and reliability. To minimize the size and weight of the power supply, conventional methods of line current rectification were abandoned in favor of lossless regulation and conversion to 400-cycles operation, thereby necessitating advanced circuitry techniques. Another problem concerned the selection of high-speed random-access memory, for which a coincident-current type memory was well suited. The structural design had to meet a high strength to weight requirement. Module temperature control was a prime consideration in the packaging technique. Evidence and experience resulting from performance and testing of the Micropac Computer led to the conclusion that the micromodule is entirely feasible for applications of this nature.