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MANUFACTURING IN-PROCESS CONTROL AND MEASURING TECHNIQUES FOR INTEGRAL ELECTRONICS.
GENERAL ELECTRIC CO SYRACUSE NY SEMICONDUCTOR PRODUCTS DEPT
This report describes a manufacturing methods program which is designed to apply a microscope-television camera-logic circuitry system to specific optical measurement problems for the in-process control of deposited films and the surfaces of semiconductor devices. The goal of this program was to design a system of this type that would provide a more accurate andor more economic measurement than is presently available. The result of the program was the development of a system that counted the number of imperfections seen in a microscopes field of view. The surface imperfections were pits, mounds, haze, and scratches. The evaluation of the imperfection counter showed that quantitative data on surface imperfections could be available. Also, the importance of the imperfections on yield could be objectively evaluated. As a consequence, higher standards of quality and better yields could be maintained. Author
Final rept. 1 Mar 64-15 May 65,