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Accession Number:
AD0450549
Title:
AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.
Corporate Author:
SIGNETICS CORP SUNNYVALE CA
Report Date:
1964-09-15
Abstract:
The schedule for making the first seal of the metal leads to the package substrate is complete. By a process of electroplating and etching metal film interconnections have been laid down, but many problems remain in this area. A few circuits were assembled on this substrate and where all previous steps were satisfactory, electrical continuity has been established. Author
Descriptive Note:
Interim development rept. no. 1, 15 June15 Sep 64.
Pages:
0022
Contract Number:
NObsr91298
File Size:
0.00MB
