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SOME QUEUING PROBLEMS WITH BALKING AND RENEGING - I
SYSTEM DEVELOPMENT CORP SANTA MONICA CALIF
A method for plating t e gold ring on the emitter side of the transistor was developed. The optimum thickness and width of the ring, and the optimum distance between it and the emi ter were also deter ined. The maximum flatness obtainable in the emitter pit was determined. A cathodic etching method was investigated and has proved extremely well suited for etching the collector pit. The optimum emitter and collector diameter were f und. The emitter and collector lead attaching process was studied an has proved satisfactory for this application. T HE STATUS OF THE PROGRAM, LIFE TEST RESULTS, AN A SCHEDULE OF LIFE TESTING TO BE PERFORMED ARE PRESENTED. Author