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Accession Number:
AD0275275
Title:
PLANAR INTEGRATION OF THIN FILM FUNCTIONAL CIRCUIT UNITS
Corporate Author:
IBM COMMAND CONTROL CENTER FEDERAL SYSTEMS DIV KINGSTON N Y
Report Date:
1962-02-28
Abstract:
The method selected for tinning thin film land areas prior to attaching microminiature semiconductor devices is described along with two alternate methods which were investigated. The technique used for attaching simultaneously several microminiature devices to a multilayer thin film panel is described. A description is given of the improvements made to the basic vacuum evaporation process. Data on resistor values obtained with nine panels is presented. A discussion of substrate size and core lamination problems is given. A d scussion is presented on the fabrication of functional assemblies by an evaporation-etch process. Data i presented on the evaluation of a completed functional assembly having overdrive capacitors. A discussion is presented on the method bywhich the basic circuit layout can be used to obtain an emitter follower driver capable of driving 25 basic NOR blocks. Author
Pages:
0001
Distribution Statement:
Availability: Document partially illegible.
Contract Number:
DA36 039SC87246
File Size:
0.00MB
