Throughput Estimate of an X-Ray Projection Lithography System,
HITACHI LTD TOKYO (JAPAN) CENTRAL RESEARCH LAB
Pagination or Media Count:
The feasibility of X-ray projection lithography is discussed with emphasis on throughput issues. A lithography system using 13nm radiation from a compact storage ring was designed. This system consists of a grazing incidence condenser mirror, a multilayer condenser mirror, a multilayer reflection mask , an imaging system with four multilayer mirrors, and an X-ray window. Calculations show that the X-ray power incident onto that the X-ray power incident onto a wafer is 0.5mW. A highly sensitive resist is required to a achieve practical wafer throughput.