Accession Number:

ADP005190

Title:

Accelerated Aging and Solderability Testing of Printed Wiring Boards,

Descriptive Note:

Corporate Author:

ROCKWELL INTERNATIONAL CEDAR RAPIDS IA COLLINS DEFENSE COMMUNICATIONS DIV

Personal Author(s):

Report Date:

1987-02-01

Pagination or Media Count:

9.0

Abstract:

There is presently much industry activity related to solderability testing. Test methods, test parameters, and accelerated aging conditions are among the items being studied. But the bulk of the activity relates to component terminations, and not to printed wiring boards pwb. At Rockwell Internationals Collins Defense Communications, test programs related to pwb aging and solderability have been ongoing for several years. Data from natural aging and from a variety of accelerated test methods have been compared. Results from several solderability test methods have also been compared. Recommendations are made for an accelerated aging method and for solderability testing of pwbs. Author

Subject Categories:

  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Test Facilities, Equipment and Methods
  • Couplers, Fasteners and Joints
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE