Accession Number:

ADP005188

Title:

Laser Inspection Calibration Baseline for Thermal Signature Analysis,

Descriptive Note:

Corporate Author:

LITTON SYSTEMS INC GRANTS PASS OR GUIDANCE AND CONTROL SYSTEMS DIV

Personal Author(s):

Report Date:

1987-02-01

Pagination or Media Count:

26.0

Abstract:

Thermal signature analysis method for the interpretation of Vanzetti laser inspection sensor data, when applied to solder joint process analysis, will be superior to existing statistical threshold methods. A thorough understanding of the laser inspection process and parameters is required along with accurate system calibration. This paper will provide a general definition of the laser inspection process and its equipment, a brief history of laser inspection and details of the system baseline development program. The system baseline development program was designed to establish a repeatable system baseline for system effects on sensor output from system component fluctuations, ambient temperature fluctuations, and target irregularities. In addition, a system transfer function was produced to derive optimum thermal signature amplitudes. A system signal-to-noise threshold was established. As a result of this program, a calibration method was developed holding signature repeatability to 2. As a result of this calibration method and subsequent thermal signature analysis, success has been measured in the detection of small subsurface solder voids.

Subject Categories:

  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Optical Detection and Detectors
  • Lasers and Masers

Distribution Statement:

APPROVED FOR PUBLIC RELEASE