Accession Number:

ADP005177

Title:

In-Line High Pressure Solvent Cleaning of Surface Mounted Assemblies. Part 1,

Descriptive Note:

Corporate Author:

ELECTROVERT LTD LAPRAIRIE (QUEBEC)

Personal Author(s):

Report Date:

1987-02-01

Pagination or Media Count:

11.0

Abstract:

A test board containing 41 surface mounted components was soldered using RMA solder paste through a flat mesh belt type infrared system and subsequently cleaned in a new in-line conveyorized solvent cleaner using high pressure spray of the stabilized azeotrope of trichlorotrifluoroethane and methyl alcohol. Cleaning results are improved with longer dwell times at lower conveyor speeds. All flux residues are removed beneath leaded SOIC and similar components but not from beneath chip components and LCCs at a speed of 3 ftmin 90 cmmin when using a spray pressure of 35 psi 2.4 bars. Keeping the conveyor speed constant, the addition of ultrasonic agitation provides a remarkable improvement. Solvent spray cleaning in the new in-line cleaner described in this paper and tested at pressures up to 250 psi 17 bars proves to be a viable alternative for removing rosin flux residues from electronic printed wiring assemblies containing all types of surface mount components including chips and LCCs where ultrasonic cleaning is prohibited or where damage may occur to certain electronic components. Author

Subject Categories:

  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Solvents, Cleaners and Abrasives
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE