Accession Number:

ADD020044

Title:

Heat-Resistant Electronic Systems and Circuit Boards with Heat Resistant Reinforcement Dispersed in Liquid Metal

Descriptive Note:

Patent, Filed 21 Jun 1999, patented 7 May 2002

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s):

Report Date:

2002-05-07

Pagination or Media Count:

14.0

Abstract:

A heat resistant system have electronic circuit components fusion bonded onto a circuit board substrate with a heat-resistant composite material. The composite material consists essentially of a solid heat-resistant reinforcement dispersed in a liquid metal matrix of the composite material. The heat-resistant reinforcement differs in density by substantially uniformly and stably distribute in the liquid composite matrix, with substantially no tendency to either sink down or float up therein. This stably uniform distribution enures improved uniformly, reproducibility and heat resistance of the circuit board.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE