Solder Paste and Residue Measurement System
Patent, Filed 24 Feb 1995, patented 12 Aug 1997
DEPARTMENT OF THE NAVY WASHINGTON DC
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This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, nonlinear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.
- Manufacturing and Industrial Engineering and Control of Production Systems