Ultrahigh Density Charge Transfer Device
Patent, Filed 13 Oct 1994, patented 7 Dec 1999
DEPARTMENT OF THE NAVY WASHINGTON DC
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Metal heated to a molten state is injected under a high hydrostatic penetration pressure into extremely small and closely spaced channels of an insulating matrix to form an array of electrically conductive pins or wires. The materials for the pins and matrix are selected for compatibility with respect to melting, matrix sintering and surface tension penetration conditions associated with the fabrication of a high density charge transfer device.
- Electrical and Electronic Equipment