Surface Modification of Synthetic Diamond for Producing Adherent Thick and Thin Film Metallizations for Electronic Packaging
Patent, Filed 25 Apr 97, patented 29 Dec 98
DEPARTMENT OF THE NAVY WASHINGTON DC
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An article and a method of making surface modified synthetic diamond substrates at temperatures below 500 deg C for electronic packaging applications are described. The article consists of a synthetic diamond substrate, the surface of which has been modified by providing an adherent thin coating of a ceramic alumina material so as to enable metallization of synthetic diamond by current industrial methods. The method of surtbce modification comprises deposition of a thin transition metal layer on the synthetic diamond substrate prior to low temperature reactive vapor deposition of aluminum followed by annealing in an oxygen atmosphere.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems