Accession Number:

ADD019066

Title:

Adhesion Enhancement for Underplating Problem

Descriptive Note:

Patent, Filed 31 Jan 96, patented 26 May 98

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Report Date:

1998-05-26

Pagination or Media Count:

8.0

Abstract:

Underplating between a metallic plating base and a photoresist deposited thereon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of a depositing a plating base on the adhesion layer b depositing on the plating base a sacrificial layer of a material that reduces or eliminates underplating on the plating base compared to underplating in absence of the sacrificial layer c depositing a photoresist on the sacrificial layer d exposing, developing and removing the exposed photoresist from the substrate to uncover a portion of the sacrificial layer e removing the sacrificial layer portion from the substrate to uncover a portion of the plating base and f depositing a metallic material on the uncovered plating base under the influence of electrical current.

Subject Categories:

  • Adhesives, Seals and Binders
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE