Adhesion Enhancement for Underplating Problem
Patent, Filed 31 Jan 96, patented 26 May 98
DEPARTMENT OF THE NAVY WASHINGTON DC
Pagination or Media Count:
Underplating between a metallic plating base and a photoresist deposited thereon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of a depositing a plating base on the adhesion layer b depositing on the plating base a sacrificial layer of a material that reduces or eliminates underplating on the plating base compared to underplating in absence of the sacrificial layer c depositing a photoresist on the sacrificial layer d exposing, developing and removing the exposed photoresist from the substrate to uncover a portion of the sacrificial layer e removing the sacrificial layer portion from the substrate to uncover a portion of the plating base and f depositing a metallic material on the uncovered plating base under the influence of electrical current.
- Adhesives, Seals and Binders
- Manufacturing and Industrial Engineering and Control of Production Systems