Accession Number:

ADD018028

Title:

Selective Metallization Process.

Descriptive Note:

Patent, Filed 25 Aug 93, patented 21 Nov 95,

Corporate Author:

ARMY FOREIGN SCIENCE AND TECHNOLOGY CENTER CHARLOTTESVILLE VA

Report Date:

1995-11-21

Pagination or Media Count:

15.0

Abstract:

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Subject Categories:

  • Coatings, Colorants and Finishes
  • Inorganic Chemistry
  • Physical Chemistry
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE