Accession Number:

ADD015913

Title:

Process to Fabricate Thick Coplanar Microwave Electrode Structures.

Descriptive Note:

Patent Application, Filed 18 Jun 93,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Report Date:

1993-06-18

Pagination or Media Count:

19.0

Abstract:

A process for making thick metal structures on a substrate has the steps of selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of the spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated and hydrated photoresist layer, to fully pattern the substrate developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution exposing the photoresist layer to a plasma for hardening the pattern against thermal flow hardbaking the photoresist pattern on the substrate plating the metal onto the patterned substrate using a low current density J during at least part of the plating process, making a thick metal structure on the substrate.

Subject Categories:

  • Electrooptical and Optoelectronic Devices
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE