Process to Fabricate Thick Coplanar Microwave Electrode Structures.
Patent Application, Filed 18 Jun 93,
DEPARTMENT OF THE NAVY WASHINGTON DC
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A process for making thick metal structures on a substrate has the steps of selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of the spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated and hydrated photoresist layer, to fully pattern the substrate developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution exposing the photoresist layer to a plasma for hardening the pattern against thermal flow hardbaking the photoresist pattern on the substrate plating the metal onto the patterned substrate using a low current density J during at least part of the plating process, making a thick metal structure on the substrate.
- Electrooptical and Optoelectronic Devices
- Electrical and Electronic Equipment