Glassy Binder System for Ceramic Substrates, Thick Films and the Like.
Patent, Filed 8 Nov 89, patented 30 Jun 92,
DEPARTMENT OF THE NAVY WASHINGTON DC
Pagination or Media Count:
A ceramic material for electronic circuit devices is sintered at less than or equal to 1000 deg C. temperature. A filler material such as quartz and a glassy binder RO. A1203-B203 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, Cao, Sro, BaO, ZnO or CdO and the glassy binders form no more than 40 vol of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.
- Electrical and Electronic Equipment
- Ceramics, Refractories and Glass