Ultra-Low-Loss Strip-Type Transmission Lines, Formed of Bonded Substrate Layers.
Patent, Filed 1 Dec 89, patented 24 Dec 91,
DEPARTMENT OF THE NAVY WASHINGTON DC
Pagination or Media Count:
A method of constructing ultra-low-loss miniaturized microstrip type microwave transmission lines, circuits, and resonators and their resulting structures are disclosed. The method includes etching a groove of the appropriate width and depth into the surface of a first substrate as determined by a preselected characteristic impedance. Appropriate thin film superconductors are then deposited on the surfaces of the first substrate and a second substrate. The thin film superconductors are then patterned after which the two substrates are sealed together by field-assisted thermal bonding such that a novel two-conductor electromagnetic transmission line results.
- Electrical and Electronic Equipment