Accession Number:

ADD015312

Title:

Ultra-Low-Loss Strip-Type Transmission Lines, Formed of Bonded Substrate Layers.

Descriptive Note:

Patent, Filed 1 Dec 89, patented 24 Dec 91,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Report Date:

1991-12-24

Pagination or Media Count:

7.0

Abstract:

A method of constructing ultra-low-loss miniaturized microstrip type microwave transmission lines, circuits, and resonators and their resulting structures are disclosed. The method includes etching a groove of the appropriate width and depth into the surface of a first substrate as determined by a preselected characteristic impedance. Appropriate thin film superconductors are then deposited on the surfaces of the first substrate and a second substrate. The thin film superconductors are then patterned after which the two substrates are sealed together by field-assisted thermal bonding such that a novel two-conductor electromagnetic transmission line results.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE