Process for Making Semiconductor-on-Insulator Device Interconnects.
Patent, Filed 13 Jul 89, patented 19 Nov 91,
DEPARTMENT OF THE NAVY WASHINGTON DC
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A process for developing conductive interconnect regions between integrated circuit semiconductor devices formed on an insulating substrate utilizes the semiconductor material itself for formation of device interconnect regions. A patterned layer of semiconductor material is formed directly on the surface of an insulating substrate. The patterned layer includes regions where semiconductor devices are to be formed and regions which are to be used to interconnect terminals of predetermined ones of the semiconductor devices. After forming the semiconductor material, the regions of the semiconductor material patterned for becoming interconnects are converted to a metallic compound of the semiconductor material. Author
- Electrical and Electronic Equipment
- Solid State Physics