Heat Sink Device for Electronics Modules Packaged in Cylindrical Casings.
Patent, Filed 28 Sep 90, patented 22 Oct 91,
DEPARTMENT OF THE NAVY WASHINGTON DC
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A device for dissipating heat from electronics encased in a circular housing is disclosed for uses in buoys, sonobuoys, mines and missiles. The device contains a heat dissipating ring that engages the inner surface of the cylindrical electronics case. The inside surface of this ring is tapered to receive a heat transfer disk that is pulled into tight union with the heat dissipating ring. A heat generating module is mounted in heat transfer union with the disk whereby excess heat is transferred from the disk through the ring to the electronics case where it is dissipated into the environment. Author
- Electrical and Electronic Equipment