Accession Number:

ADD015066

Title:

Method of Joining Diamond Structures.

Descriptive Note:

Patent Application, Filed 8 Jul 91,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Report Date:

1991-07-08

Pagination or Media Count:

11.0

Abstract:

This invention relates to diamond materials and more particular to methods of bonding diamond pieces together. Diamond is the ideal material for a large number of applications. Diamond is highly transparent to infrared radiation IR and radar, has the highest known heat conductivity, highest known hardness, produces little friction, does not conduct electricity, etc. Thus, diamond has properties that make it desirable as structural material for many applications, including radomes. Patent applications.

Subject Categories:

  • Inorganic Chemistry

Distribution Statement:

APPROVED FOR PUBLIC RELEASE