Accession Number:

ADD014882

Title:

Method and Device for Stand-Off Laser Drilling and Cutting.

Descriptive Note:

Patent, Filed 7 Oct 88, patented 26 Sep 89,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s):

• Copley, John A.
• Kwok, Hoi S.
• Domankevitz, Yacov

Report Date:

1989-09-26

Pagination or Media Count:

7.0

Abstract:

A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drillingcutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-runningQ-switched dual mode.

Descriptors:

• CUTTING
• DETONATION WAVES
• DRILLING
• LASERS
• MATERIALS
• MELTS
• PERFORATION
• Q SWITCHING
• RANGE(DISTANCE)
• SHORT PULSES
• SHORT RANGE(TIME)
• STANDOFF
• TARGETS

Subject Categories:

• Machinery and Tools
• Lasers and Masers

Distribution Statement:

APPROVED FOR PUBLIC RELEASE