Method and Device for Stand-Off Laser Drilling and Cutting.
Patent, Filed 7 Oct 88, patented 26 Sep 89,
DEPARTMENT OF THE NAVY WASHINGTON DC
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A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drillingcutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-runningQ-switched dual mode.
- Machinery and Tools
- Lasers and Masers