Accession Number:
ADD014796
Title:
Fluorinated Epoxy Resins with High Glass Transition Temperatures.
Descriptive Note:
Patent, Filed 27 Mar 89, patented 1 Jan 91,
Corporate Author:
DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s):
Report Date:
1991-01-01
Pagination or Media Count:
8.0
Abstract:
Fluoroepoxy resins for use in computer composite circuit boards. A glass state curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210 C. The curing agent is blended with di- and tri-functional epoxy resins at 100 C. or higher to give homogeneous fat-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with high crosslink densities and higher glass transition temperatures.
Descriptors:
Subject Categories:
- Plastics