Fluorinated Epoxy Resins with High Glass Transition Temperatures.
Patent, Filed 27 Mar 89, patented 1 Jan 91,
DEPARTMENT OF THE NAVY WASHINGTON DC
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Fluoroepoxy resins for use in computer composite circuit boards. A glass state curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210 C. The curing agent is blended with di- and tri-functional epoxy resins at 100 C. or higher to give homogeneous fat-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with high crosslink densities and higher glass transition temperatures.