Accession Number:

ADD014796

Title:

Fluorinated Epoxy Resins with High Glass Transition Temperatures.

Descriptive Note:

Patent, Filed 27 Mar 89, patented 1 Jan 91,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s):

Report Date:

1991-01-01

Pagination or Media Count:

8.0

Abstract:

Fluoroepoxy resins for use in computer composite circuit boards. A glass state curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210 C. The curing agent is blended with di- and tri-functional epoxy resins at 100 C. or higher to give homogeneous fat-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with high crosslink densities and higher glass transition temperatures.

Subject Categories:

  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE