A Method of Soldering Aluminum.
Patent Application, Filed 29 Aug 89,
DEPARTMENT OF THE NAVY WASHINGTON DC
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This invention relates to methods of joining metal parts and more particularly to methods of soldering aluminum. Accordingly an object of this invention is to provide a new method of soldering aluminum and its alloy. Another object of this invention is to provide treated aluminum surfaces which can easily be soldered. These and other objects of this invention are accomplished by providing a process comprising 1 wetting an aluminum or aluminum alloy surface with molten silver nitrate 2 heating the AgNO3 coated aluminum surface at a temperature of from the decomposition temperature of AgNO3 to about 550 C to decompose the AgNO3 and form a Ag metal film. Patent applications. JES
- Metallurgy and Metallography