Accession Number:

ADD014159

Title:

Fluorinated Epoxy Resins with High Glass Transition Temperatures.

Descriptive Note:

Patent Application, Filed 27 Mar 89,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s):

• Griffith, James R.

Report Date:

1989-03-27

Pagination or Media Count:

19.0

Abstract:

An object of this invention is to provide a fluoroepoxy resin with a high glass transition temperature. And, an object of this invention is to provide a fluoroepoxy resin for use in computer composite circuit boards. Also, an object of this invention is to provide a fluoroepoxy resin which will withstand a processing temperature of 250C and an operating temperature of 100C. Further, an object of this invention is to provide a curing agent for epoxy resins which will increase the glass transition temperature of these resins. These and other objects are accomplished by a glassy state curing agent containing a monoanhydride and a dianhydride which when mixed with an epoxy resin produces a polymer with higher crosslink densities, resulting in higher glass transition temperatures. Keyword Patent applications AW

Descriptors:

• *CIRCUIT BOARDS
• *CURING AGENTS
• *EPOXY RESINS
• *FLUOROPOLYMERS
• *PATENT APPLICATIONS
• COMPUTERS
• CROSSLINKING(CHEMISTRY)
• DENSITY
• FLUORINE
• GLASS
• HIGH TEMPERATURE
• POLYMERS
• TRANSITION TEMPERATURE
• VITREOUS STATE
• ANHYDRIDES

Subject Categories:

• Plastics
• Industrial Chemistry and Chemical Processing
• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE