Fluorinated Epoxy Resins with High Glass Transition Temperatures.
Patent Application, Filed 27 Mar 89,
DEPARTMENT OF THE NAVY WASHINGTON DC
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An object of this invention is to provide a fluoroepoxy resin with a high glass transition temperature. And, an object of this invention is to provide a fluoroepoxy resin for use in computer composite circuit boards. Also, an object of this invention is to provide a fluoroepoxy resin which will withstand a processing temperature of 250C and an operating temperature of 100C. Further, an object of this invention is to provide a curing agent for epoxy resins which will increase the glass transition temperature of these resins. These and other objects are accomplished by a glassy state curing agent containing a monoanhydride and a dianhydride which when mixed with an epoxy resin produces a polymer with higher crosslink densities, resulting in higher glass transition temperatures. Keyword Patent applications AW
- Industrial Chemistry and Chemical Processing
- Electrical and Electronic Equipment