Substrate Handling System.
Patent, Filed 27 Jan 87, patented 11 Oct 88,
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
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A substrate handling system supplies new wafers to a vacuum chamber containing a lithography system, and outputs processed semiconductor wafers to an environment with normal atmospheric pressure. New wafers on a transplate pass by way of an air film track to a transload which feeds them from a load platform to a vacuum lock elevator. The inner door of the vacuum lock elevator opens and a completed transplate is transferred to the shelf of the vacuum lock elevator. Next the vacuum lock elevator lifts to its upper position and the subsequent transfer of a new transplate onto a worktable occurs. There follows the closing of an inner door venting of the vacuum lock, the opening of an outer door, and the insertion of a new transplate from the load platform to the bottom shelf of the elevator. Finally, the completed transplate is removed. In cases where negative photoresists are used, this last step is replaced by routing the transplate to the past cure chamber for a period of up to 30 minutes. Patents. EDC
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems